Enhanced Electronics Cooling Using Parametrization in Ansys Icepak

Hi everyone, in this video I will show you how to parameterize the position of the fan to obtain the lowest temperature in the circuit. We have different components, so let's begin creating the geometry. Modify the cabinet size. Notice that I'm using the Start-End mode for the coordinates.

Now let's create and set up the fan. Select the plane and tap the size. As the fan will move in the side direction, we need to type the coordinates first and then the initial position. In Ansys Icepak, we can work with fans having their characteristic curves. This is the case.

In the Properties tab, select Nonlinear and then Text Editor. Now type the coordinate pairs of the curve to define the pressure flow rate behavior. In the next step, generate the curve and define its rotational speed. Then type the operating speed for the fan.

For the grille, select the plane and type the dimensions. For the grill, select the plane and type the dimensions. For the grill, select the plane and type the dimensions. We want the grill to cover all the outlet surface.

In the Properties tab, modify the Free Area Ratio to 0. 5. Repeat the same steps for the PCV. This time the position is at the bottom of the cabinet. In the Properties tab, define the thickness, the material, and the heat flux. The IC chips will be modeled as blocks.

Begin by creating the block, setting up its properties, and then making three copies in a linear range. You can use a method to just fill the block in. It would still be full. Which would be a new problem in the Portuguese version. Obviously, that means it's still in the positive form.

I'm trying to shape it into a material, and sipping from high to low freedom mode froze-out. So, we're just going to go ahead and give it the stresses we can finally calculate the pressure. Follow the same steps for the second row of IC chips. This time select Network from the Type list.

Set up the properties and make 3 copies again. The domain has an empty space, so we can create a hollow block to include this condition. Here just define the dimensions of the block. Finally, create the heat sink that will help to reduce the temperature.

As usual, define the plane and the dimensions. Do not forget to add the base and overall height. Choose the sink type and complete the setup. Thank you. The components are now complete. In this step, we create assemblies to have non-conformal meshes for better quality.

Create assemblies for the fan and another for the IC chips. Now we can generate the mesh and check the quality. We need to define the different positions of the fan as part of the parametrization. Under Solve, select Define Trials.

You see the initial value there, but type the rest of the values you prefer. All values can be seen on the Trials tab. Click on Close. It is recommended to define one variable as a value. At least, to monitor during the simulation.

Finally, define the basic settings and parameters as part of the model setup. Run the optimization including the points you prefer. The first simulation will take the first position of the fan and the rest will be solved in sequence.

Once the last model is finished, you can load the results for each trial solved. Go to the Post menu, select Load Solution ID, and pick the sets of results you want to assess. Create contour plots or any other option to post-process your results.

Here we want to know the temperature for each position of the fan. We can also add a value to the temperature of the fan. And that's all for today. Apply this setup in your simulations. Thanks for watching. (Title: Enhanced Electronics Cooling Using Parametrization in Ansys Icepak)