Thermal Management & Electronics Cooling Simulation Consulting
Ozen Engineering provides advanced thermal simulation consulting services to support the development and optimization of heat-critical systems across electronics, automotive, aerospace, and industrial applications.
With extensive Ansys experience—including Icepak, Fluent, and Mechanical, among others—we accurately model conduction, convection, and radiation phenomena under both steady-state and transient conditions.
Our simulations support informed design decisions, help prevent thermal failures, and reduce reliance on physical prototyping by capturing real-world behavior early in the development cycle. From board-level cooling to full-system thermal architecture, we deliver simulation-driven insights that improve reliability, performance, and thermal efficiency.
Our expertise includes:
- Electronics Cooling
Chip-level junction temperature prediction, board-level heat spreading, and assembly-level airflow and enclosure ventilation modeling to ensure thermal reliability across integrated electronic systems. - Power Systems
Inverter, motor, and power module cooling (air, liquid, or hybrid-cooled)
- Battery Thermal Management
Our streamlined workflows enhance engineering efficiency, promoting robust design refinement, sensitivity testing, and superior performance. - Aerospace Thermal Systems
Passive/active cooling in low-pressure and radiation-dominant environments - Industrial & Embedded Systems
Thermal control of sealed enclosures, outdoor-rated units, and high-power systems - Modeling of Multiphysics Heat Sources
Including heat generation from Joule heating, eddy currents, RF fields, DCIR losses, mechanical friction, and optical absorption for accurate thermal analysis in complex systems. - Heat Exchangers & Thermal Interfaces
Optimizing the performance of heaters, coolers, evaporators, condensers, vapor chambers, and other heat exchange systems across steady-state and transient conditions.
Semiconductor Package Thermal AnalysisCharacterize and model thermal resistance from junction to case (RθJC), board (RθJB), and ambient (RθJA), including PSI metrics for accurate package-level thermal performance. Simulate steady-state and transient behavior to ensure compliance with thermal specifications and improve thermal interface design.
Aerospace Thermal SystemsApply radiation and conduction modeling in Ansys Mechanical and Fluent to evaluate thermal control systems in low-pressure or high-altitude conditions. Simulate multi-surface radiation exchange, insulation performance, and active/passive thermal regulation.
PCB & Electronics CoolingUtilize Ansys Icepak to model board-level heat dissipation and airflow across densely populated PCBs. Simulate conduction through vias, component junction temperatures, and enclosure ventilation to ensure thermal compliance and prevent early failure.
EV Battery Thermal ManagementConduct transient thermal analysis of battery modules using Ansys Fluent or Icepak. Evaluate thermal propagation between cells, cooling plate efficiency, and enclosure heat retention under drive-cycle loading and ambient variation..
Industrial Enclosure CoolingSimulate forced and natural convection in sealed or vented enclosures using Icepak and Fluent. Assess internal airflow, fan placement, and thermal loading under varying ambient conditions to maintain component reliability.
Liquid Cooling & Cold PlatesUse conjugate heat transfer modeling to evaluate the performance of cold plates and fluid-cooled components. Simulate coolant flow, heat flux distribution, and pressure drops to optimize channel geometry and thermal contact.
Rack & Data Center CoolingLeverage Ansys Fluent to simulate airflow through server racks, CRAC systems, and containment aisles. Predict thermal zones, recirculation paths, and delta-T across equipment to improve cooling efficiency and energy usage.
Harsh Environment ElectronicsPerform coupled thermal simulations for sealed or conformal-coated electronics exposed to solar load, high humidity, or wide ambient ranges. Evaluate heat sink effectiveness, material selection, and thermal mass tradeoffs in constrained thermal environments.
Advancing Thermal Design with Engineering Simulation Expertise
At Ozen, we apply advanced Ansys thermal simulation tools—including Ansys Icepak, Fluent, Mechanical, Thermal Desktop, and Ansys Discovery—to solve critical heat transfer and cooling challenges across electronics, aerospace, automotive, and industrial systems.
Ansys Icepak is purpose-built for electronics cooling, enabling detailed thermal analysis of PCBs, IC packages, and entire enclosures. Ansys Fluent provides high-fidelity CFD for modeling forced/natural convection, radiation, and fluid-driven cooling across complex geometries. Ansys Mechanical complements these tools with robust capabilities for conduction-dominant and coupled thermal-structural analyses.
For large-scale or orbit-based systems, we utilize Thermal Desktop to simulate thermal behavior in radiative and low-convection environments. Ansys Discovery supports early design-phase thermal iteration, accelerating decisions when speed and insight are key.
Whether you’re optimizing a heatsink layout, evaluating cold plate performance, or simulating a complete thermal architecture, Ozen delivers simulation-driven insights to help you meet reliability, performance, and compliance targets.
Need support with thermal challenges? Connect with us to explore how we can help you design and validate more efficient thermal systems.
