Semiconductors Capabilities
Power Integrity Signoff
Dynamic and static IR drop analysis for full-chip and IP signoff of both digital and analog designs
Power Integrity Signoff
Timing Impact of IR Drop
Timing analysis of critical paths with fast, SPICE-accurate, voltage variability models
Timing Impact of IR Drop
2.5D/3D-IC Electrothermal Signoff
Chip Package System co-design
2.5D/3D-IC Electrothermal Signoff
RTL Power Analysis and Reduction
Analyze, debug and reduce power and rapidly profile vectors for power-efficient RTL
RTL Power Analysis and Reduction
Electromagnetic Analysis for Silicon
High Capacity Electromagnetic Modeling Engine For High-Speed RF and Digital SOCs
Electromagnetic Analysis for Silicon
Electrostatic Discharge (ESD) and Substrate Noise Analysis
Comprehensive reliability analysis and simulation for more robust designs
Electrostatic Discharge (ESD) and Substrate Noise Analysis
Cloud-Native Elastic Compute Architecture
World’s first big data architecture for electronic system design and simulation